Company Profile

Company name

SANTEC co.,ltd.

Representative Director
and President

Shigeru Sugiyama

Date of Foundation

March 20, 1973

Capital

99,000,000 yen

Number of employees

271 (As of September 30, 2021)

Business Line

Production and sales of Precision mold / Various automatic devices / Paper Carrier Tape and Embossed Carrier Tape / Plastic molding products

Head office location

55-3 Nakayama, Kurate-machi, Kurate-gun, Fukuoka
807-1312 Japan
Telephone: +81-949-42-6991 Facsimile: +81-949-42-8027
URL: http://www.santec‒j.com

Main Bank

THE NISHI-NIPPON CITY BANK, LTD. / THE BANK OF FUKUOKA, LTD. / Resona Bank, Limited / The Shoko Chukin Bank, Ltd. / The Kumamoto Bank, Ltd.

Japan

• AIR WATER MATERIALS INC.
• AISIN KYUSHU Co.,Ltd.
• Amkor Technology Jaoan, Inc.
• Canon Inc.
• DENSO CORPORATION
• DENSO KYUSHU Co.,ltd.
• DNP Technopack Inc.
• ELNA CO., LTD.
• FUJIFILM Corporation
• I-PEX Inc.
• J.S.T.MFG.CO.,LTD.
• JAPAN PULP AND PAPER COMPANY LIMITED
• Kowa Emori Company, Ltd.
• KYOCERA Corporation
• MMI SEMICONDUCTOR Co., Ltd.
• Nichicon Corporation
• Nippon Chemi-Con Corporation
• ROHM Co., Ltd.
• Seiko Epson Corporation
• Sharp Corporation
• Sony Corporation
• SUN Electronic Industries Corporation
• TAIYO YUDEN CO.,LTD.
• Texas Instruments Japan Limited

Overseas

Indonesia

SHARP SEMICONDUCTOR INDONESIA P.T. (SSI).

Pt Unisem Batam Indonesia ltd.

Korea

Amkor Technology Korea Inc.

Singapore

STATS Chip PAC Singapore (SCS) Co.,Ltd.

Singapore Epson Industrial Pte. Ltd.

Thailand

Microchip Technology Thailand Ltd.

ROHM Integrated Systems (Thailand) Co., Ltd.

Taiwan

Texas Instruments Taiwan Co.,Ltd.

Philippines

Texas Instruments (Philippines) Inc.

Malaysia

Texas Instruments Malaysia Sdn.Bhd.

Amkor Technology Malaysia Sdn.Bhd.

Denso (Malaysia) SDN. BHD.

Mexico

Texas Instruments de Mexico, S. de R.L. de C.V.

China

STATS Chip PAC Shanghai (SCC) Co.,Ltd.

Renesas Semiconductor (Beijing) Co.,Ltd.

Wuxi Tongzhi Microelectronics Co.,Ltd.